Laser Scribing System for Wafer
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Model: TH-3221 series, TH-5210 series
Introduction
1.Equipped with CNC system, the laser scribing system for wafer is outstanding as scribing expert for its high speed, precision, stability and flexibility.
2. It adoptsCCD fast positioning and real-time coaxial or paraxial monitoring.
3. Non-contact processing generates no mechanical stress, thus improving the quality of chips.
4. It has stable and durable marble base with small thermal deformation.
5. This wafer scribing system is equipped with high-precision 2D linear table and DD rotating platform.
Application
The laser scribing system is widely used for the scribing on integrated circuit wafer, GPP diode wafer, GPP silicon wafer, and the slot cutting on low-k materials.
| Laser Type | IR | UV |
| Specification/Model | TH-3221 series | TH-5210 series |
| Laser Wavelength | 1034nm | 355nm |
| Laser Power | 20w | 5w |
| Max. Wafer Processing | 4 inch | 6 inch |
| Scribing Speed | 150mm/s | 30mm/s |
| Scribing Line Width | 40-55um | 20-30um |
| Scribing Line Depth | 50-120um | 50-100um |
| System Positioning Precision | ±2 um | ±2 um |
| Repetition Positioning Precision | 1 um | 1 um |
| Laser Life | 100, 000 hours | 12, 000 hours |
Sample
- The laser scribing system for wafer
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