Ball Wafer Cutting Machine
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The ball wafer cutting machine is employed for punching and separating spherical wafer biscuits in one step, and these ball wafers are delivered to receive further treatment while corresponding leftover materials are collected automatically.
Technical Data of Ball Wafer Cutting Machine
1. Conveyor belt: 0.37kW×2 sets, 380V/3Ph/50Hz (SEW)
2. Air consumption of punching cylinder: 0.1m3/min/0.6MPa (FESTO or SMC)
Related Names
Ball Wafer Cutter | Ball Wafer Punch | Ferrero Wafer Cutting Machine | Chocolate Hazelnut Ball Production Equipment
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