Wafer Distributing Device
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When the wafer cutting process is completed, the wafer bars will be conveyed to the wafer distributing device which is a wafer machine used for spacing wafers coming out of the automatic wafer cutting machine on rails and automatically transferring them to the chocolate coating machine or packaging machine. The distribution rail of this wafer device can be changed to process different product dimensions.
Specifications of Wafer Distributing Device
Materials: Frame is made of GB steel bars; rails are made of 304 stainless steel
Motor: Germany SEW motor
Dimension (L×W×H): 3000×1500×820(mm)
Power: 0.5Kw
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