Electronic Encapsulation and Heat Sinking Silicone Gel
Model No.
LSG6931-20A/B, LIM6936-40A/B, LSG6931-50A/B
Product Description
The electronic encapsulation and heat sinking silicone gel is a two-component platinum catalyzed liquid silicone rubber in which the mixing ratio of the two components is 1:1. This silicone gel features high temperature resistance, zero oil leakage, high heat dissipation capability, it is non-toxic, environmentally friendly, and more. Its fluidity and conductivity can be modified according to specific customer requirements. This silicone gel is used in encapsulation and heat sinking for electronic chips such as PCB, CPU, MPU, LED, etc.
Packing
The electronic encapsulation and heat sinking silicone gel is packed in 1kg or 20kg barrels.
| Properties | Test method | Unit | LSG6931-20A/B | LIM6936-40A/B | LSG6931-50A/B |
| Appearance | White | Pink | Off white | ||
| Specific gravity | D792 | 1.35 | 2.041 | 1.55 | |
| Thermal conductivity | W/ m.K | 1.6 | 1.05 | 3.0 | |
| Mixing ratio | 1:1 | 1:1 | 1:1 |
Note:
The above technical properties are for reference only. For detailed molding conditions, please contact us directly.
We are an electronic encapsulation and heat sinking silicone gel manufacturer and supplier, based in China. Our company continually implements new technologies and produces new products. SQUARE silicon products are used in such fields as electronic products, electric power, medical instruments, baby products, kitchenware, automobiles, textiles, mechanical engineering, consumer products etc.
Shenzhen SQUARE Silicone Co., Ltd.
Address:Building 9th, 3rd Phase, Hemei Industrial Park, Pingzi Road, Pingdi Block, Shenzhen, PR China 518117
Tel.:
(Overseas)
Ext:837
Fax: 86-755-28805428
