Non-Pressure Silver Sinter Paste
Request a Quote
- The JF-PMAg01 is a nanosilver paste designed for pressureless sintering processes. It exhibits excellent electrical conductivity and maintains a stable amount of adhesive during extended dispensing processes. After sintering, the silver layer formed is uniformly dense, allowing for efficient heat dissipation in high-power devices. Its thermal conductivity far surpasses that of traditional soldering materials.
- PL-400CP is a silver paste suitable for non-pressure sintering process in cooper surface. Featuring excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
- PL-500LT is a silver paste suitable for non-pressure sintering process at low temperature. Featured by excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
Related Manufacturies
Leave Message
Similar Manufacturies and Parts
Manufacturer Advertising
More
Similar Manufacturies and Parts
Videos
