Reflow Oven, GSD-S5C
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Fully-Automatic Reflow Soldering Machine, Reflow Soldering Machine, SMT Reflow Oven
Technical Parameters| Items | Parameters |
| Heating zones | 10 |
| Length of heating zone | 1740mm |
| Heating method | Hot air infrared |
| Cooling method | Air cooling |
| Width of PCB | 350mm |
| Conveyor direction | Left to right |
| Conveyor height | 880±20mm |
| Conveyor method | Mesh belt |
| Conveyor speed | 0-2000mm/min |
| Power | 5-wire 3-phase 380V 50HZ |
| Total power | 4.5KW/17.5KW |
| Heating time | 15 minutes |
| Temperature control | Room temperature-300℃ |
| Temperature control method | PID closed-loop control system, SSR |
| Temperature control accuracy | ±1℃ |
| Temperature difference of PCB | ±2℃ |
| Alarm | Temperature anomaly |
| Dimensions | L3000*W700*1400mm |
| Weight | 320KG |
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