Electroformed Bond Blades
If you're searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools, please browse the other pages.
Features
1. The ultra-thin design allows the circular blade to be used for deep cutting and slotting.
2. The blade thickness ranges from 0.015mm to 0.3mm.
3. Thanks to a combination of multiple specifications of diamond particles and various bonds, these electroformed dicing blades can be used for cutting and slotting compound semiconductors, silicon wafers and ceramic wafers.
Applicable Materials
Silicon wafer, compound wafer with gallium arsenide, gallium phosphide, ceramics, lithium niobate, lithium tantalite and more.
| 1. Series RE: Electroformed soft blade 2. Grit size 3. Concentration 4. Groove quantity | 5. Bond hardness type A Ultra soft B Soft C Hard D Ultra hard S Special | 6. O.D 7. I.D 8. Thickness |
**NOTE: The contents in the above picture provide relevant specifications for the electroformed bond blades. During the purchasing, please tell us all related factors so we can communicate and find the right product for you.
Technical Parameters of Electroformed Bond Blades| O.D | Thickness | I.D | ||||
| Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
| 50~100 | 0.020~0 | 0.030~ ≤0.060 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 | 0.020~0 | |
| 0.060~ ≤0.200 | ±0.005 | ±0.003 | ||||
| 0.200~ ≤0.400 | ±0.010 | ±0.005 | ||||
