Copper Core Ball

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Copper core ball is suitable for fine pitch joint and 3D package in semiconductor industry. As electronic devices become more and more compact and multifunctional, chips are required to be more integrated, which cannot be satisfied by traditional packaging technics, therefore, 3D packaging technics such as stack packaging are in development and more and more applied. Copper core ball satisfies material requirements for 3D packaging, as it better solves the solder joint collapse and even short circuit issue during PKG caused by previous solder joint melting during reflow soldering.

Typical 3D Package

Solder ball type	Material	Copper core diameter/μm	Nickel plating thickness/μm	Outer plating thickness/μm
Tin-plated copper core ball	HP-CuB-Sn	50-800	2-5	5-50
Gold-plated copper core ball	HP-CuB-Au	50-800	2-5	0.08-0.2
Copper core ball with other plating	SC/SAC/SA and others	50-800	2-5	5-50

Features

With copper core balls for packaging, room for highly reliable internal structure can be ensured, shrink packaging can be realized as well.
Good conducting, heat-dissipating and electromigration-resisting performance.