Wafer Laminating Machine
Our wafer laminating machine is utilized to stack wafer biscuits together after these biscuits have been coated with chocolate.
Working Process
1. Wafer biscuits travel on the separation conveyor belt first, and accordingly, they are separated from each other with a certain distance between them because the separation conveyor belt moves faster than the previous one.
2. A lamination conveyor belt is placed next to the separation conveyor belt, and there is an optoelectronic switch on the top of the belt. When this switch detects that the first wafer biscuit is coming, a corresponding cylinder will act to turn up the rear tipping plate, so as to tilt the first biscuit to about 30 degrees. After that, when the second biscuit is detected, the second and third cylinders will act simultaneously to laminate the first and second wafer biscuits together.
Technical Data of Wafer Laminating Machine
1. Conveyor belt: 0.37kW×2 sets, 380V/3Ph/50Hz (SEW)
2. Air consumption of up and down cylinder: 0.05m3/min/0.6MPa (FESTO or SMC)
Related Names
Flip-Over Wafer Biscuit Laminating Machine | Ball Wafer Laminating Machine | Wafer Biscuit Production Equipment | Food Machinery
