Laser Perforating System for Wafer
Introduction
1.The laser perforating system for wafer adopts German IPG laser, which features stable power, long life, and does not ask for maintenance.
2. The optical path is fixed and the platform moves. The pores are consistent in shape with high aspect ratios, perfect roundness and good verticality.
3. It adopts high-speed synchronized moving perforating system. The pitch can be set freely and the pores will be arranged automatically.
4. It can perforate according to DXF and PLT graphics.
5. It adopts double-loop position control with high accuracy.
6. The vacuum suction makes it easy to clean dusts. The machine can be put in clean rooms.
Application
The laser perforating system is applicable to silicon wafers, semiconductor wafers, amorphous films, etc.
Sample
- Sample 1 The laser
perforating system - Sample 1 The laser perforating
system
