Flame Retardant and Thermally Conductive Electronic Potting Glue , JF-124AB
Flame retardant thermally conductive epoxy resin is a two-component adhesive used for potting applications. It is specifically designed to provide flame retardancy and thermal conductivity. This epoxy resin can cure at room temperature or moderate temperatures, offering a moderate curing speed. It has excellent flowability, allowing it to easily penetrate into small gaps and voids in the product. After curing, it has a smooth surface, no bubbles, high hardness, not shrinkage, excellent insulation, thermal conductivity, heat dissipation, and flame retardant properties. It is also waterproof, moisture-proof, dust-proof, and leakage-proof. It has strong weather resistance and good impact resistance. The color can be adjusted according to customer requirements.
- Potting and encapsulating aquarium water pumps, transformers, sensors, buzzers, atomizers, ion generators, ignition coils, power modules, electronic controllers, and other electronic components.
- It is suitable for potting, encapsulation protection, and insulation against moisture for electronic or other products.
| Model | ||
| Color | Black Liquid | Clear Liquid |
| Specific Gravity at 25℃ | 1.40±0.1g/cm3 | 1.05±0.1g/ cm3 |
| Viscosity at 25℃ | 10000-13000cps | 50-100cps |
| Mix Ratio (Weight) | 5:1 | |
| Useable Life | 60 min (25℃, 100g) | |
| Cure Time | 12 hours (25℃) or 2 hours (80℃) | |
| Hardness | Shore D | 80 |
| Bending strength | Kg/ mm2 | 12-14 |
| Tensile Strength | Kg/ mm2 | 10-12 |
| Compressive Strength | Kg/ mm2 | 22-24 |
| Water Absorption at 25℃ | $ hours | < 0.15 |
| Thermal Conductivity | W/(m·K) | 0.8 |
| Dielectric Constant | 1KHZ | 3.8-4.2 |
| Volume Resistivity at 25℃ | Ohm.cm | ≥1.0x1015 |
| Surface Resistivity at 25℃ | Ohm | ≥1.0x1014 |
| Voltage Withstand at 25℃ | Kv/mm | 16-18 |
| Coefficient of Thermal Expansion | m/℃ |
The packaging specification is 30kg per set, which includes 25kg/barrel of the main agent and 5kg/barrel of the curing agent.
