Epoxy Potting Compounds, JF-139L Manufacturer

Epoxy Potting Compounds, JF-139L

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Clear low viscosity epoxy resin is a type of crystal clear epoxy resin system that cures at room temperature or moderate temperatures. It possesses a low viscosity, good leveling properties, and excellent defoaming performance. The curing process occurs at a moderate speed, resulting in cured material with remarkable transparency, high hardness, smooth surface, brightness, absence of bubbles, and strong adhesion. Additionally, the cured material exhibits good resistance to solvents, impact, and yellowing.

Application

Surface coating and drop coating of various metal nameplates, badges, seals, buttons, magnetic buckles, circuit boards, crafts, and other products.
Surface encapsulation of other hard products.
It is not suitable for drop coating on surfaces of elastic or soft products.

Technical Parameters

Liquid Properties

Item	Stand	Part A	Part B
Appearance	Visual Inspection	Clear liquid	Clear liquid
Viscosity (cps,25℃)	GB/T 10247-2008	4000~5000	200~300
Gravity (g/cm3)	GB/T 15223-1994	1.1	0.98
Mix Ratio	Weight	A:B=3:1
Mixed System Viscosity (cps,25℃)	GB/T 10247-2008	1500~2500
Useable Life (25℃)	GB/T 10247-2008	60min(100g)
Gel Time (25℃)	GB/T 10247-2008	6~8 hours
Cure Time (25℃)	GB/T 10247-2008	12-16 hours or 60-80℃/1.5-2 hours

Cured System

Item	Stand	Part A	Part B
Appearance	Visual Inspection	Clear rigid material
Hardness (Shore D,24hr)	GB/T 531-2008	70~80
Tensile Strength (kg/cm²)	GB/T 6328-1999	12~13
Compressive Strength (kg/cm)	GB/T 17517-1998	20~22
Bending Strength(kg/cm)	-	14~15
Thermal Deformation Temperature (℃)	-	90~105
Water Absorption (25℃，24hr)	-	< 0.01%
Temperature Range (℃)	GBT 20028-2005	-30~130
Shrinkage (%)	GB/T 15585-1995	0.35~0.55

Packaging:

The packaging specification is 20kg per set, which includes 15kg (in barrel) of component A and 5kg (in pot) of component B.