Low Viscosity Electrical Potting Compounds, ZS-GF-5299E
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ZS-GF-5299E RTV Silicone Potting Compounds
Description
The ZS-GF-5299E RTV silicone potting compounds is a low viscosity, two-component product for sensor potting. It cures at room temperature or via heating, and features a faster curing at higher temperatures, with no byproduct production during curing. This allows it to be used for substrates on metals and plastics such as PC (Poly-carbonate), PP, ABS, PVC and more. Temperature range of -60℃ to 220℃, and fully satisfies EU RoHS and REACH standards.
Typical applications
- Potting, encapsulating and thermal protection of sensors
- Potting, encapsulating and thermal protection of electrical and electronic components like power modules
Technical specs
| Performance index | Component A | Component B | |
| Uncured properties | Appearance | Black, gray, white fluid | White fluid |
| Viscosity (cps) | 1500～2500 | 1500～2500 | |
| Mix ratio/A:B by weight | 1∶1 | ||
| Mixing viscosity (cps) | 1500～2500 | ||
| Working time at room temperature (min) | 30-50 | ||
| Cure time at room temperature T (h) | T+5℃: 1-3 | ||
| T: 3-5 | |||
| T-5℃: 5-9 | |||
| Cured properties | Hardness (Shore A) | 40-50 | |
| Thermal conductivity[W/m.K] | ≥0.6 | ||
| Dielectric Strength (kV/mm) | ≥15 | ||
| Dielectric constant (1.0MHz) | 2.4～3.0 | ||
| Volume resistivity (Ω·cm) | ≥1.0×1013 | ||
| Specific gravity (g/cm3) | 1.56±0.02 | ||
Note:
- The above uncured properties are measured at room temperature where the product is produced.
- Mechanical and electrical properties are tested after the products are fully cured.
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