Non-Corrosive RTV Silicone Potting Compounds, ZS-GF-118
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ZS-GF-118 RTV Silicone Potting Compounds
Description
The ZS-GF-118 RTV silicone encapsulates offer an outstanding adhesion to numerous substrates such as PC, ABS, aluminum, copper, stainless steel and PCB. When curing, it produces little micro molecules, which are non-corrosive to substrates. These silicone encapsulates feature a high transparency, outstanding electrical insulation, water resistance, yellowing resistance, and resistance to high and low temperatures, making them ideal for thin-section potting and conformal coating of electrical and electronic components and LEDs.
Typical applications
Potting and encapsulating of delicate electronic components, LED light bars, backlights and solar cells.
Technical specs
| Performance index | Component A | Component B | ||
| Uncured properties | Appearance | Transparent liquid | Clear liquid | |
| Viscosity (cps) | 1200-1800 | 10-30 | ||
| Mix ratio/A:B by weight | 10∶1 | |||
| Mixing viscosity (cps) | 1000-1400 | |||
| Working time (min) | 30～60 | |||
| Cure time (h) | 3-5 | |||
| Cured properties | Hardness (Shore A) | 12-18 | ||
| Specific gravity | 0.95~1.00 | |||
| Dielectric Strength (kV/mm) | ≥18 | |||
| Dielectric constant (1.2MHz) | 3.0～3.3 | |||
| Volume resistivity (Ω·cm) | ≥1.0×1014 | |||
| Service temperature range (℃) | -60～200 | |||
Note:
- The above technical specs are measured at a room temperature of 25℃ and 55% RH.
- Mechanical and electrical properties are tested after the products are fully cured.
- The above data is provided for reference only and is subject to the measured data by customers.
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