Silicone Encapsulant for LED Chip (Non-Adhesive)

Silicone Encapsulant for LED Chip (Non-Adhesive)
Silicone Encapsulant for LED Chip (Non-Adhesive)
Silicone Encapsulant for LED Chip (Non-Adhesive)
Silicone Encapsulant for LED Chip (Non-Adhesive)
Silicone Encapsulant for LED Chip (Non-Adhesive)
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Model:
SR2630-A/B

The SR2630-A/B silicone encapsulant is a non-adhesive LED encapsulation material. It is featured by normal refractive index, high toughness and outstanding thermal stability and anti-UV performance, without self-adhesive performance. This is a perfect silicone solution for your LED encapsulation needs.

Packaging
1kg/bottle

Typical Properties
Before curing Physical properties SR2630A SR2630B
Appearance Colorless and transparent Colorless and transparent
Refractive index (25°C) 1.41 1.41
Density (g/ cm) 1.05 1.05
Viscosity (25°C) mPa·s 5500 4500
Mixing ratio 100 100
Viscosity after mixing (25°C ) mPa·s 5000
Operable time (25°C) > 8h
After curing SHORE hardness 70A
Refractive index (25°C) 1.41
Tensile strength (Mpa) 7
Elongation (%) 100%
Light transmittance (450 nm, 1 mm) 94%

Notes:
1) Curing condition is recommended to be first cure 100℃ x1 hours post cure 150℃ x3hours
2) The silicone encapsulant should be stored at room temperature in an indoor dry and ventilated place and kept out of direct sunlight. Shelf life is 12 month.
3) Viscosity is measured by NDJ-79 rotary viscosimeter.
4) Above table is only for reference use. Contact us detailed molding process.

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