Thermally Conductive Cure-in-Place Potting Compounds, ZS-GF-5299Z-30 Manufacturer

Thermally Conductive Cure-in-Place Potting Compounds, ZS-GF-5299Z-30

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ZS-GF-5299Z-30 RTV Silicone Potting Compounds

Description

The ZS-GF-5299Z-30 is a medium viscosity, two-part, heat curing, high thermally conductive sealant. The higher the temperature, the faster it cures. No byproduct occurs during curing, making this potting compound applicable to substrates including plastics and metals like PC(Poly-carbonate), PP, ABS, PVC and more. Temperature range of -40℃ to 200℃ and fully meets EU RoHS and REACH standards.

Typical applications

Potting, encapsulating and thermal protection of power modules and other electron components

Technical specs

Performance index			Component A	Component B
Uncured properties		Appearance	Light red liquid	Offwhite liquid
		Viscosity (cps)	12000～18000	12000～18000
		Mix ratio/A:B by weight	1∶1
		Mixing viscosity (cps)	12000-18000
		Working time at room temperature (min)	60-90
		Cure time at room temperature (h)	4-6
Cured properties	Hardness (Shore A)		50-60
	Thermal conductivity[W/m.K]		≥3.0
	Dielectric Strength (kV/mm)		≥13
	Dielectric constant (1.0MHz)		2.8-3.3
	Volume resistivity (Ω·cm)		≥1.0×1013
	Specific gravity (g/cm3)		3.0±0.1

Note:

The above uncured properties are measured at room temperature where the product is produced.
Mechanical and electrical properties are tested after the products are fully cured.
Zhaoshun cannot assume responsibility for different results obtained under different conditions or caused by product improvement.