Ceramic Grinding Application Manufacturer

Ceramic Grinding Application

Request a Quote

View All: http://grinding-dispersing.com/ceramic-grinding.html

Ceramics encompass a wide array of materials, including super-hard ceramics, high toughness ceramics, semi-conductive ceramics, magnetic ceramics, and transparent ceramics. With such a diverse array of types, they are used in an equally diverse array of applications, including machinery, chemicals, electronics, optics, aviation, military and more.

Main methods for ceramic material performance improvement:

grinding the ceramic material into particles as fine as possible
controlling the ceramic particle size distribution to ensure performance won’t be affected by particles that are too wide
increasing particle dispersion as much as possible

Because applications are significantly impacted by the grinding quality, ceramic materials must be fully ground before use. Our grinding mills meet all the challenges posed by a ceramic ultra-high hardness and ultra-high wear resistance, ensuring a top of the line final quality.

Shown here are the results from ultrafine grinding of different ceramic materials using our grinding machines. The particle sizes of these ceramic powders has been significantly reduced and distribution is exceptionally more uniform after grinding.

Grinding of silicon nitride (Si₃N₄)

Before grinding
2. After grinding
2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	0.8	0.10
D90(μm)	2.1	0.15

Grinding of hexagonal boron nitride (h-BN)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	2.5	0.15
D90(μm)	3.5	0.28

Grinding of silicon carbide (SiC)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	8.5	0.032
D90(μm)	12	0.052

Grinding of boron carbide (B₄C)

2. Before grinding
2. After grinding
2. Before grinding
2. After grinding

Grinding time	0h	3h	12h
D50(μm)	7.7	0.48	0.035
D90(μm)	14.8	0.66	0.053

Grinding of zirconia (ZrO₂)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	1.2	0.05
D90(μm)	2.0	0.07

Grinding of zirconium silicate (ZrSiO₄)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	0.8	0.10
D90(μm)	2.3	0.20

Grinding of strontium titanate (SrTiO₃)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	2.88	0.050
D90(μm)	8.01	0.129

Grinding of barium carbonate (BaCO₃)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50(μm)	9.35	0.097
D90(μm)	19.50	0.198

Grinding of α-aluminum (α-Al₂O₃)

2. Before grinding
2. After grinding

Characterized size	Feed	Products
D50	1.2μm	43nm
D90	2.1μm	71nm