Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
The Sn64Bi35Ag1 mid temperature lead free solder paste indicates that the alloy consists of the 64% tin content, the 35% bismuth content, and the 1% silver content. Its operating temperature can be divided into the preheat temperature from 110 degrees Celsius to 160 degrees Celsius, the melting point of 189 degrees Celsius, and the reflow temperature from 210 degrees Celsius to 150 degrees Celsius. This product is desirable for the reflow soldering process which has relatively high demand.
Moreover, the 1% silver content is doped with the active bismuth, which allows this type of tin paste to be applicable for the low or medium temperature type electrical equipment sets. Owing to the outstanding wetting property and soldering performance, this Sn64Bi35Ag1 mid temperature lead free solder paste is particularly suitable for the welding of circuit boards.
Applications
Our Sn64Bi35Ag1 mid temperature lead free solder paste can be used in the LED circuit boards, various lamps, computer motherboards, phone motherboards, printed circuit boards, surface mount technology, as well as all kinds of high-precision circuit boards.
| Heating Rate | Time Required for Reaching 110ºC | Constant Temperature 110 - 138ºC | Peak Temperature | 210±10℃ | Cooling Rate |
| 1-3 ºC/sec | < 60-90 seconds | 60-100 seconds | 175 ±5ºC | 30-60 seconds | < 4ºC / S |
- Once receiving the Sn64Bi35Ag1 mid temperature lead free solder paste, our clients had better put this product into a refrigerator for storage. We suggest that the solder cream should be kept in cold storage at a temperature range from 2 degrees Celsius to 8 degrees Celsius. The warranty period is 6 months from the date of production. Moreover, our cargo should conform to the First in First out principle.
- The solder paste needs to be kept at a room temperature before being used. The recommended time is 4 hours. After the temperature recovery, the storage life reaches 48 hours. Once the Sn64Bi35Ag1 mid temperature lead free solder paste is unsealed, the storage life will be 12 hours. It takes 100±20 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process starts.
- The residual solder cream is not allowed to be mixed with the new solder cream in one bottle.
| Type | Chemical Composition (wt. %) | ||||||
| Sn | Bi | Ag | Pb | Fe | Al | Cd | |
| Sn64-Bi35-Ag1 | 64±0.5 | 35±0.5 | 1±0.5 | < 0.01 | < 0.02 | < 0.001 | < 0.002 |
Established in 2006, Jufeng Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. With over a decade of experience in the soldering industry, we mainly supply a variety of solder wire, solder bar, solder paste, solder powder, flux, and the soldering machines, among others.
Our product can be widely applied in such fields as the telecommunications, electrical appliances, electronic instruments, meters, and much more. Our company has achieved the ISO9001:2000 and ISO9001:2008 certifications. Plenty of our environmentally-friendly products have obtained the SGS, RoHS, and some others.
Related Names
Tin Bismuth Solder Paste | Low Temperature Soldering Paste | SMT Rework Solder Paste
