FC-325LA Large Area Silver Sintering Paste Manufacturer

FC-325LA Large Area Silver Sintering Paste

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Website: http://jfsolder.com/12-2-large-area-sinter-silver-paste.html

FC-325LA is a silver paste designed for pressure-assisted large-area sintering processes, offering excellent electrical conductivity while maintaining operational stability during extended printing. It is also compatible with dry or semi-wet bonding processes.
After sintering, the silver layer is uniform and dense, providing high reliability and excellent thermal conductivity for the bonding of high-power devices.

Features

High thermal conductivity
High electrical conductivity
High operation temperature
High reliability

Parameters

Item	Data	Remark
Viscosity	3±1Pa·s	@100s-1 Tested by rheometer
Density	5.0g/cm³	Before sintering
Solid content	70~75%	TGA
CET	14ppm/℃	TMA
Thermal conductivity	＞200W/m·K	Laser flash
Resistivity	＜6μohm·cm
Melting point	961℃	DSC
Applicable surface	Ag/Au/Cu
Operating lifespan	8 hours	@19-25℃
Storage temperature	Freezing or refrigeration	Freezing: -20~0°C Refrigeration: 0~10°C
Shelf life	6 months