Green Silicon Carbide

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GreenSilicon Carbide
Ourgreen silicon carbide is manufactured in strict conformation with FEPA and JISstandards. A product of highpurity materials and salt additives, the carbide is forged through a resistancefurnace at an approximate temperature of 2200℃. The resulting product is a semi-conductor with excellent thermalconductivity. Appearing as a darkgreen translucent hexagonal crystal, this substance possesses a greaterhardness than black silicon carbide, due to higher concentrations of thesilicon carbide. Practical applicationsfor this abrasive medium include the grinding of glass, ceramics, hard alloys,and nonmetallic materials. It is also an ideal candidate forsemiconductor materials and high-temperature silicon carbide heating units.

Specifications

Chemical composition(GB/T2480-1996)
Grit	SiC	F.C.	Fe2O3
F20~F90	≥ 99.50	<0.20	≤ 0.20
F100~F150	≥ 98.50	<0.25	≤ 0.50
F180~F220	≥ 97.50	<0.25	≤ 0.70
F230~F400	≥ 97.00	<0.30	≤ 0.70
F500~F800	≥ 95.50	<0.40	≤ 0.70
F1000~F1200	≥ 94.00	<0.50	≤ 0.70
P12~P90	≥ 99.00	<0.20	≤ 0.20
P100~P150	≥ 98.50	<0.25	≤ 0.50
P180~P220	≥ 97.50	<0.25	≤ 0.70
P240~P1000	≥ 97.00	<0.30	≤ 0.70
P1200~P2500	≥ 95.50	<0.40	≤ 0.70
Special requirements on chemical compositions can be satisfied through further discussion

Thisproduct can be categorized into the coating abrasive and the abrasive. The coating abrasive grain size ranges between P12 andP2500. The bonded abrasive is moreversatile and has various size ranges, includingthe F20 to F90 range and the F1000 to F1200 range. The coarser the grains, the more siliconcarbide it contains. For instance, the grain size ranging between F20 and F90contains 99.5% silicon carbide. This imbues the abrasive with extreme hardnessand it can be used for cutting or grinding highly hard materials.