Transparent Electronic Potting Compound, JF-212A225B
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Clear epoxy resin encapsulant is an environmentally friendly epoxy resin adhesive that can be cured at room temperature or moderate temperature, with a moderate curing speed. The cured material has excellent transparency, smooth and glossy surface, no bubbles, moderate hardness, and strong adhesion, as well as good solvent resistance and moisture/waterproof performance.
Application
It is suitable for transparent encapsulation of LED lamp modules, electronic transformers, power module assemblies, sensors, high-voltage packages, electronic component resistors, electronic triggers, and various equipment requiring moisture-proof, waterproof, and high-temperature resistance protection.
Technical Parameters
Appearance and Physical Properties| Model | ||
| Color | Transparent liquid | Transparent liquid |
| Specific Gravity at 25℃ | 1.09 g/cm3 | 0.93 g/cm3 |
| Viscosity at 25℃ | 4200-6000cps | 20-30cps |
| Shelf Life at 25℃ | 6 months | 6 months |
| Hardness | Shore D | 80 |
| Bending Strength | Kg/mm2 | 14-15 |
| Tensile Strength | Kg/mm2 | 12-13 |
| Impact Strength | Kg/mm2 | 20-22 |
| Water Absorption at 25℃ | $ hours | < 0.1 |
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